Sony SPP-114 Service Manual
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Sony SPP-114 Service Manual

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SERVICE MANUAL
MICROFILM
Handset
SPECIFICATIONS
General
Frequency control
Crystal-controlled PLL
Operation mode
FM, duplex
Operation channel
25 channels
Supplied accessories
AC power adaptor AC-T56 (1)
Telephone line cord (1)
Rechargeable battery pack BP-T16 (1)
Directories (2 sheets)
Handset
Power source
Rechargeable battery pack BP-T16
Battery life
Standby: Approx. 14 days
Talk:
Approx. 6 hours
Approx. 58 × 194 × 47 mm (w/h/d), antenna
Dimensions
excluded
Antenna: Approx. 110 mm
Mass
Approx. 220 g, battery included
Base unit
Power source
DC 9V from AC power adaptor
Battery charging time
Approx. 12 hours
Approx. 132 × 56 × 220 mm (w/h/d), antenna
Dimensions
excluded
Antenna: Approx. 310 mm
Mass
Approx. 310 g
Design and specifications are subject to change without notice.
SPP-114
Base unit
CORDLESS TELEPHONE
E Model
1

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Summary of Contents for Sony SPP-114

  • Page 1 SPP-114 SERVICE MANUAL E Model Handset Base unit SPECIFICATIONS General Frequency control Crystal-controlled PLL Operation mode FM, duplex Operation channel 25 channels Supplied accessories AC power adaptor AC-T56 (1) Telephone line cord (1) Rechargeable battery pack BP-T16 (1) Directories (2 sheets)

  • Page 2: Table Of Contents

    COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

  • Page 3: General

    SECTION 1 GENERAL This section is extracted from instruction manual.

  • Page 6: Disassembly

    SECTION 2 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 2-1. CABINET (LOWER) (BASE UNIT) 1 P 3x10 2 P 3x10 4 cabinet (lower) 3 connector 2-2. CABINET (REAR) (HANDSET) 3 claws 1 battery case lid assy 2 BTP 2.6x10 4 cabinet (rear)

  • Page 7: Test Mode

    SECTION 3 TEST MODE BASE UNIT SECTION MACHINE TEST MODE Set the Test Mode: 1. With one of the CH setting terminals in “H” input state, cause MANUAL TEST MODE Reset of Power ON. Equipment enters machine test mode. Set the Test Mode: 2.
  • Page 8 Channel Setting: During startup in machine test mode, make the following channel settings by loading the terminal input data. Pin No. TX frequency RX frequency (MHz) (MHz) Channel (TP61) (TP62) (TP63) (TP64) 43.720 48.760 43.740 48.840 43.820 48.860 43.840 48.920 43.920 49.020 43.960...

  • Page 9: Handset Section

    HANDSET SECTION MACHINE TEST MODE Set the Test Mode: 1. When power on reset is applied while a “H” (high) is input the MANUAL TEST MODE TEST SW (TP43) terminal (IC501 $º pin), the RING (Level Set the Test Mode: H, 500 msec.) sounds.
  • Page 10 Channel Setting: During startup in machine test mode, make the following channel settings by loading the terminal input data. Pin No. TX frequency RX frequency ROW5 ROW4 ROW3 ROW2 ROW1 (MHz) (MHz) Channel (TP13) (TP14) (TP15) (TP16) (TP17) 48.760 43.720 48.840 43.740 48.860...
  • Page 11 Key Processing (Setting the Manual Test Mode) : 1. (Upper position) (Lower position) Set with #. 2. 3X# can be substituted with X . Upper position Lower position QUIT 10 ch 20 ch Batt Alarm KEY TEST 1 ch 11 ch 21 ch CHARGE DET 2 ch...

  • Page 12: Electrical Adjustments

    SECTION 4 ELECTRICAL ADJUSTMENTS BASE UNIT SECTION RX SECTION ADJUSTMENT RX LEVEL Adjustment Note: Note: • Apply 9V dc from regurated DC power supply. • Perform the adjustment at T3CH (28CH : 49.910 MHz) as a rule. • Perform the adjustment at T3CH (28CH : 49.910 MHz) as a rule. Setting : •...
  • Page 13 Adjustment Location : – base main board (component side) – L101 FL101 RV101 – base main board (conductor side) – TP104 TP19 TP105 TP23 IC101 IC501...

  • Page 14: Handset Section

    HANDSET SECTION RX SECTION ADJUSTMENT RX LEVEL Adjustment Note: Note: • Apply 3.6 V dc from regurated DC power supply. • Perform the adjustment at T1CH (26CH : 43.780 MHz) as a rule. • Perform the adjustment at T1CH (26CH : 43.780 MHz) as a rule. Setting : •...
  • Page 15 Adjustment Location : – hand main board (side A) – RV101 L102 FL101 – hand main board (side B) – TP27 TP26 IC501 IC101 TP30...

  • Page 16: Diagrams

    SECTION 5 DIAGRAMS 5-1. IC PIN DESCRIPTIONS • IC501 SB662104A-4L43-TLM (SYSTEM CONTROL) (BASE UNIT) Pin No. Pin Name Pin Description Strobe signal output to PLL. DATA Serial data output to PLL. Serial clock output to PLL. RX-DATA RX data input SIG-IN RSSI/PLL-LOCK signal input (L: RSSI, H: PLL-LOCK) H-MUTE...
  • Page 17 • IC501 SH66356C-4L44 (SYSTEM CONTROL) (HANDSET) Pin No. Pin Name Pin Description TEST CH Test mode channel control output (L: Active) KEY LED Key LED ON/OFF control output (L: ON) (Fixed at “H” in this set.) SIG-IN RSSI/PLL-LOCK signal input (L: RSSI, H: PLL-LOCK) PLL-STB Strobe signal output to PLL.

  • Page 18: Block Diagram -Base Unit Section

    SPP-114 5-2. BLOCK DIAGRAM — BASE UNIT SECTION — ANT1 TELESCOPIC ANTENNA D101 B+ (+5.2V) FL101 460KHz MIX, IF AMP, DET RX LEVEL EXPANDER IC101 (1/3) IC101 (2/3) BPF1 CF101 46MHz 460KHz MJ201 B+ (+5.2V) T201 RECEIVER LINE CF102 LINE E-MUTE 10.68MHz...

  • Page 19: Block Diagram -Handset Section

    SPP-114 5-3. BLOCK DIAGRAM — HANDSET SECTION — ANT2 B+ (+3.6V) HELICAL S101 ANTENNA FL101 460KHz MIX, IF AMP, DET RX LEVEL EXPANDER IC101 (1/3) IC101 (2/3) RECEIVER BPF1 CF101 49MHz 460KHz RECE-IN QUAD SPEAKER – CF102 E-MUTE 10.68MHz MIX IN...

  • Page 20: Printed Wiring Board -Base Unit Section

    SPP-114 5-4. PRINTED WIRING BOARD — BASE UNIT SECTION — • Semiconductor Location Ref. No. Location D101 D201 D203 D204 D205 D301 D401 D501 IC101 IC301 G-10 IC501 PH201 Q201 Q202 Q301 Q302 F-10 Q401 Q402 Q403 Note on Printed Wiring Boards: Note on Schematic Diagram: •...

  • Page 21: Schematic Diagram -Base Unit Section

    SPP-114 5-5. SCHEMATIC DIAGRAM — BASE UNIT SECTION —...

  • Page 22: Printed Wiring Board -Handset Section

    SPP-114 5-6. PRINTED WIRING BOARD — HANDSET SECTION — • Semiconductor Location Ref. No. Location Ref. No. Location IC501 B-10 D202 B-14 D301 A-14 Note: D501 • X : parts extracted from the component side. Caution: D502 A-10 • : Carbon pattern.

  • Page 23: Schematic Diagram -Handset Section

    SPP-114 5-7. SCHEMATIC DIAGRAM — HANDSET SECTION — • Refer to page 24 for Note.

  • Page 24: Exploded Views

    SECTION 6 EXPLODED VIEWS Note on Schematic Diagram: NOTE: • All capacitors are in µF unless otherwise noted. pF: µµF • The mechanical parts with no reference • -XX and -X mean standardized parts, so • Accessories and packing materials and 50 WV or less are not indicated except for electrolytics number in the exploded views are not supplied.

  • Page 25: Handset Section

    6-2. HANDSET SECTION MIC1 ANT2 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark X-3377-828-2 LID ASSY (G), BATTERY CASE * 58 3-033-764-01 CUSHION (BUZZER) 3-038-923-01 CABINET (REAR) 1-771-708-11 SWITCH, RUBBER KEY (HAND) * 53 A-3622-319-A HAND MAIN BOARD, COMPLETE 3-371-005-01 GASKET (RECEIVER) (TWN) 3-939-070-01 TERMINAL, ANTENNA 3-038-925-01 CABINET (FRONT)

  • Page 26: Electrical Parts List

    SECTION 7 BASE MAIN ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since The components identified by mark ! or dotted line with mark. the parts list may be different from the they are seldom required for routine service.
  • Page 27 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark CF102 1-577-070-11 FILTER, CERAMIC < COIL > < CONNECTOR > JW19 1-469-456-21 INDUCTOR 1.2uH JW20 1-469-456-21 INDUCTOR 1.2uH * CN301 1-506-984-11 PIN, CONNECTOR (PC BOARD) 2P 1-469-453-21 INDUCTOR 0.68uH 1-412-255-11 INDUCTOR...
  • Page 28 BASE MAIN HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R113 1-216-065-00 RES,CHIP 4.7K 1/10W R524 1-216-097-00 RES,CHIP 100K 1/10W R114 1-216-077-00 RES,CHIP 1/10W R525 1-216-097-00 RES,CHIP 100K 1/10W R115 1-216-089-00 RES,CHIP 1/10W R526 1-216-097-00 RES,CHIP 100K 1/10W...
  • Page 29 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-162-587-11 CERAMIC CHIP 0.039uF C505 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 1-164-004-11 CERAMIC CHIP 0.1uF C511 1-163-104-00 CERAMIC CHIP 30PF 1-164-337-11 CERAMIC CHIP 2.2uF C513 1-163-104-00 CERAMIC CHIP 30PF 1-163-021-11 CERAMIC CHIP 0.01uF...
  • Page 30 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark JR130 1-216-296-00 SHORT R106 1-216-049-11 RES,CHIP 1/10W JR131 1-216-296-00 SHORT R107 1-216-077-00 RES,CHIP 1/10W JR132 1-216-296-00 SHORT R108 1-216-246-00 RES,CHIP 100K 1/8W JR133 1-216-295-00 SHORT R109 1-216-097-00 RES,CHIP 100K 1/10W...
  • Page 31 HAND MAIN Ref. No. Part No. Description Remark < VARIABLE RESISTOR > RV101 1-241-770-11 RES, ADJ, CARBON 1M < SWITCH > S101 1-692-989-11 SWITCH, SLIDE (VOL) < VIBRATOR > X101 1-760-326-11 VIBRATOR, CRYSTAL (10.2MHz) X501 1-760-324-11 VIBRATOR, CRYSTAL (4.048MHz) ************************************************************* MISCELLANEOUS *************** 1-771-708-11 SWITCH, RUBBER KEY (HAND) (HANDSET)
  • Page 32 SPP-114 Sony Corporation 99I0421-1 9-870-002-11 Printed in Japan C1999. 9 Digital Telecommunication Company Published by Mobile Electronics Company Quality Assurance Dept.

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