Sony MDR-NC500D Servise Manual page 15

Noise canceling headphones
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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• Y : parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
diagrams.
• Lead layouts
Lead layout of conventional IC
CSP (Chip Size Package)
• Waveforms
– MAIN Board –
IC472
(SW1)
0.5 Vp-p
472 ns
200 mV/DIV, 200 ns/DIV
IC472
(SW2)
0.6 Vp-p
468 ns
200 mV/DIV, 200 ns/DIV
MDR-NC500D
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• A : B+ Line.
• H : adjustment for repair.
• Power voltage is dc 3.7 V and fed with regulated dc power
supply from CN403 pin 1 and pin 2 on the CHARGER
board.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 MΩ).
surface
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO (ANALOG)
J
: AUDIO (DIGITAL)
N
: MONITOR
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Abbreviation
CND : Canadian model
JE
: Tourist model
IC473
(SW1)
IC501
0.7 Vp-p
468 ns
81.5 ns
200 mV/DIV, 200 ns/DIV
100 mV/DIV, 50 ns/DIV
IC473
(SW2)
0.7 Vp-p
472 ns
500 mV/DIV, 200 ns/DIV
• Circuit Boards Location
MAIN board
(XTO)
0.2 Vp-p
15
15
– Rch –
POWER board
MODE board
RESET board
MDR-NC500D
– Lch –
CHARGER board
JACK board

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