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Sony SPP-S9003 Service Manual

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SPP-S9003
SERVICE MANUAL
E Model
SPECIFICATIONS
CORDLESS TELEPHONE
MICROFILM
1

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Summary of Contents for Sony SPP-S9003

  • Page 1 SPP-S9003 SERVICE MANUAL E Model SPECIFICATIONS CORDLESS TELEPHONE MICROFILM...

  • Page 2: Table Of Contents

    4-2. Base Unit Test Mode B ............11 WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS 4-3. Handset Test Mode .............. 12 MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 4-4. RF Testing ................13 5. ELECTRICAL ADJUSTMENTS 5-1. Base Unit Section ..............16 5-2.

  • Page 3: General

    SECTION 1 This section is extracted from instruction manual. GENERAL...

  • Page 6: Disassembly

    SECTION 2 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. 2-1. BATTERY CASE LID (HANDSET) 2-2. CABINET (REAR)(HANDSET) Cabinet (rear) Nickel cadmium battery Two screws (BTP 2.6x8) Battery case lid 2-4. CABINET AND BOARDS (BASE UNIT) 2-3. HAND MAIN BOARD (HANDSET) 6 Antenna terminal Screw (BTP 2.6x12) 4 Three connectors...

  • Page 7: Mhz System Operation

    SECTION 3 900 MHz SYSTEM OPERATION 3-1. ACCESS METHOD 3-2. PROTOCOL 1. Transfer format & rate 1. General The transfer format & rate of our system is as follows; This system realizes the TX/RX superframe by TDD system. The relation of master/slave dose not decide identification regarding Table 3-1.
  • Page 8 4. Stand-by Mode Operation (1) HANDSET When the HANDSET is the stand-by mode (sleep mode), the HANDSET do the intermittent operation for power save, be- cause the HANDSET is the battery operation. This process of stand-by mode operation is as follows. 10 sec 10 sec Heart-Beat...
  • Page 9 5. Link Establishment Master Slave According to the following Fig. 3-1, the requested side for link establishment is the master. The system have to exchange the A-Frame for link establishment, and each system ID should be the same ID, and then the system A-Frame link is established.

  • Page 10: Test Mode

    SECTION 4 TEST MODE 4-1. BASE UNIT TEST MODE A 4-1-1. BASE UNIT Test Mode A-1 1. In test mode idling A and the P (PULSE)/ T (TONE) switch set to the P (PULSE) state, pressing the HANDSET LOCATOR Manual System Test Mode key changes the mode as shown below.

  • Page 11: Base Unit Test Mode B

    4-2-1. BASE UNIT Test Mode B-1 4-2. BASE UNIT TEST MODE B 1. In test mode idling B with the P (PULSE)/T (TONE) switch set to the T (TONE) state, pressing the HANDSET LOCATOR key Manual System Test Mode changes the mode as shown below. 2.

  • Page 12: Handset Test Mode

    4-3. HANDSET TEST MODE [Handset AUDIO Input/Output Level Measurement [CODEC Forward Loopback (L1); 2-4-#]] [Start-Up] 1. Press the TALK , 0 , and 1 keys simultaneously to start. Setting: 2. The normal ringer is rung at a high level for 500 msec after start- ing, and the TALK LED and BATT LOW LED blink together.

  • Page 13: Rf Testing

    4-4. RF TESTING E) MMI Test This test is for checking the RF system without disassembling the Mode/Operation Command set in servicing. Perform measurement using the spectrum analyzer 5-1-# Key matrix test and jig antenna. 5-2-# Does not function 4-4-1. RF Testing method Does not function 5-3-# Please follow the below instruction to perform RF test.
  • Page 14 • Transmission Wave: –16.00 dBm ATTEN 10 dB 903.392 MHz 0 dBm 10 dB/ –5 –6 –1 –4 –7 903.392 MHz 18dB –3 –16.00 dBm –2 –8 –9 CENTER 904.2 MHz SPAN 5.000 MHz Fig. 4 50.0 msec 30 KHz 30 kHz Fig.
  • Page 15 • Measurement: Measure peak level by Spectrum analyzer. 903.587 MHz .0 dBm AT 10 dB –3.67 dBm PEAK PLOTTER ADRS WA SB SC FC CORR CENTER 903.600 MHz SPAN 5.000 MHz RES BW 1.0 MHz VBW 100 kHz SWP 20.0 msec •...

  • Page 16: Electrical Adjustments

    SECTION 5 ELECTRICAL ADJUSTMENTS 3. Checking TX Output 5-1. BASE UNIT SECTION Setting: • Make the set in Test mode (see page 10) peak power meter 1. Checking RX I&Q Output Level Setting: ANTENNA TERMINAL – oscilloscope level meter TP558: RXIP Procedure: TP557: RXIN 1.

  • Page 17: Handset Section

    5-2. HANDSET SECTION 3. Checking TX Output Setting: • Make the set in Test mode (see page 10) peak power meter 1. Checking RX I&Q Output Level Setting: ANTENNA TERMINAL (TP812) – oscilloscope level meter TP804: RXIP Procedure: TP803: RXIN 1.
  • Page 18 ADJUSTMENT LOCATION: [BASE MAIN BOARD] (Conductor Side) TP555 : RXQN TP556 : RXQP TP557 : RXIN TP558 : RXIP level meter Chcking RX I & Q Output Level short : TP515 ˜ TP567 (GND) Checking TX Center Frequency ANTENNA TERMINAL : Checking RX I &...

  • Page 19: Diagrams

    SPP-S9003 SECTION 6 DIAGRAMS 6-1. IC BLOCK DIAGRAM WAVEFORMS THIS NOTE IS COMMON FOR PRINTED WIRING – BASE UNIT SECTION – BOARDS AND SCHEMATIC DIAGRAMS. • HAND MAIN Board (In addition to this, the necessary note is printed IC502 S-24C01AFJA-TB-01 in each block.)

  • Page 20: Printed Wiring Board - Base Unit Section

    SPP-S9003 6-2. PRINTED WIRING BOARD – BASE UNIT SECTION – • Semiconductor Location Ref. No. Location D323 D326 D327 IC501 Q902 Q903 Q904 Q905 Q907 Q908...
  • Page 21 SPP-S9003 • Semiconductor Location Ref. No. Location D101 D102 D103 D104 D105 D106 D107 D108 D301 D303 E-10 D304 D310 D501 D502 D503 D504 IC301 IC302 IC502 Q101 Q102 Q103 Q301 Q302 G-10 Q303 Q304 E-10 Q305 Q306 Q307 • Semiconductor Location Ref.

  • Page 22: Schematic Diagram - Base Unit (1/2) Section

    SPP-S9003 6-3. SCHEMATIC DIAGRAM – BASE UNIT (1/2) SECTION – • See page 19 for Waveforms. • See page 19 for IC Block Diagram. • See page 20 for Printed Wiring Board. • See page 26 for IC Pin Functions.

  • Page 23: Schematic Diagram - Base Unit (2/2) Section

    SPP-S9003 6-4. SCHEMATIC DIAGRAM – BASE UNIT (2/2) SECTION – • See page 20 for Printed Wiring Board. PH101 RINGER DETECT RING DET PH102 JC511 EXT OFF HOOK DETECT JC510 C942 C948 0.01 HOOK ON/OFF CONTROL C931 RX MUTE C968 R931 4.7k...

  • Page 24: Printed Wiring Board - Handset Section

    SPP-S9003 6-5. PRINTED WIRING BOARD – HANDSET SECTION – • Semiconductor Location Ref. No. Location D201 D-12 D202 D-10 D203 D-11 D205 D-10 D206 D207 C-11 D208 D-12 D209 D-11 D414 D-601 B-13 D801 IC201 D-10 IC401 IC402 Q201 Q202...

  • Page 25: Schematic Diagram - Handset Section

    SPP-S9003 6-6. SCHEMATIC DIAGRAM – HANDSET SECTION – • See page 19 for Waveforms. • See page 27 for IC Pin Functions. C808 C809 8200P C616 8200P C627 (ANTENNA) (SPEAKER) D422 RD5.6SB L803 4.7nH D401 RD5.6SB C624 SWITCH D413 RD5.6SB-t1...

  • Page 26: Ic Pin Functions

    SPP-S9003 6-7. IC PIN FUNCTIONS • BASE MAIN BOARD IC501 R6753-71 (HUMMINGBIRD ASIC) Pin No. Pin Name Function Pin No. Pin Name Function VSSC – VSS supply to core CDCICLK – Bit clock input/output for digital serial interface Not used (open) VDDP –...
  • Page 27 • HAND MAIN BOARD IC401 R6753-71 (HUMMINGBIRD ASIC) Pin No. Pin Name Function VSSC – VSS supply to core VDDP – VDD supply to pad ring VSSP – VSS supply to pad ring OSCO 9.6 MHz crystal oscillator output OSCI 9.6 MHz crystal oscillator input RING ON/OFF Detection signal input of the ringer coming...
  • Page 28 Pin No. Pin Name Function Bit clock input/output for digital serial interface Not used (open) CDCICLK – Codec reset RESETOP Keypad bidirectional control/LCD data KEYPADC0 – Keypad bidirectional control/LCD data KEYPADC1 – Keypad bidirectional control/LCD data KEYPADC2 – Keypad bidirectional control/LCD data KEYPADC3 –...

  • Page 29: Exploded Views

    SECTION 7 EXPLODED VIEWS NOTE: • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. •...

  • Page 30: Base Unit Section

    A-3622-374-A BASE(MAIN) BOARD, COMPLETE 3-034-830-01 HOLDER (HAND SET) 3-037-080-01 CAP(ANTENNA) 3-034-825-01 LENS(BASIC) 3-034-834-01 TERMINAL (B BATTERY), CHARGE 3-034-831-01 BUTTON (H.L.) 4-946-905-11 ENBLEM (NO.4.5), SONY 3-034-829-01 LID(BASE), BATTERY CASE * 56 1-674-890-11 LED BOARD 3-034-826-01 PANEL (BASIC) 3-034-833-01 TERMINAL (BASE), CHARGE...

  • Page 31: Electrical Parts List

    SECTION 8 BASE (MAIN) ELECTRICAL PARTS LIST Note: • Due to standardization, replacements in the parts list • SEMICONDUCTORS The components identified by In each case, u: µ , for example: may be different from the parts specified in the mark ! or dotted line with mark uA...: µ...
  • Page 32 BASE (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C970 1-162-318-11 CERAMIC CHIP 1000P JC302 1-216-295-00 SHORT C971 1-163-020-00 CERAMIC CHIP 8200PF JC501 1-216-864-11 METAL CHIP 1/16W JC502 1-216-295-00 SHORT C972 1-163-021-11 CERAMIC CHIP 0.01uF JC503 1-216-296-00 SHORT C973...
  • Page 33 BASE (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark Q907 8-729-049-65 TRANSISTOR 2SC5595-T146 R528 1-216-295-00 SHORT R529 1-216-041-11 RES,CHIP 1/10W Q908 8-729-049-65 TRANSISTOR 2SC5595-T146 R532 1-216-073-00 METAL CHIP 1/10W R550 1-216-025-00 RES,CHIP 1/10W < RESISTOR > R551 1-216-809-11 RES,CHIP 1/16W...
  • Page 34 BASE (MAIN) HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < MODULATOR > C421 1-164-360-11 CERAMIC CHIP 0.1uF C423 1-164-360-11 CERAMIC CHIP 0.1uF RFU801 1-418-269-11 RF UNIT C424 1-162-915-11 CERAMIC CHIP 10PF < SPARK GAP > C425 1-162-974-11 CERAMIC CHIP 0.01uF...
  • Page 35 HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark D418 8-719-988-61 DIODE 1SS355TE-17 R402 1-216-294-00 RES,CHIP 1/8W R403 1-412-995-21 INDUCTOR 22uH D419 8-719-988-61 DIODE 1SS355TE-17 R404 1-216-073-00 METAL CHIP 1/10W D420 8-719-988-61 DIODE 1SS355TE-17 R405 1-216-073-00 METAL CHIP 1/10W D422...
  • Page 36 SPP-S9003 HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R618 1-216-017-00 RES,CHIP 1/10W MISCELLANEOUS R619 1-216-017-00 RES,CHIP 1/10W ************* R620 1-216-057-00 METAL CHIP 2.2K 1/10W 1-771-616-11 SWITCH, RUBBER KEY R621 1-216-017-00 RES,CHIP 1/10W ANT1...

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