Advertisement
Item Description
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Description #1 Phillips Screwdriver
Description #2 Nut driver
Description #3 Pliers
Description #4 Diagonal cutting pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove 14 screws from left and right rackmount brackets. Remove rackmount brackets
2. Remove 4 screws. Remove chassis top cover.
3. Remove mylar fan duct.
4. Remove 4 memory modules.
5. Remove 2 screws. Remove 2 M.2 SSDs.
6. Unplug connectors. Remove 3 screws. Remove small PCBA.
7. Unplug 3 fan connectors from mainboard.
8. Remove coin battery.
9. Remove 1 CRPS PSU from Chassis
9.1. User flat head screwdriver, unlatch over and case.
9.2. Remove cover by sliding the cover off the case.
10. Remove 9 screws. Remove Mainboard.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
P1、P2
5mm
MF877-01
Quantity
of items
included
in
product
0
0
0
Page 2
Advertisement
