LG Prada KE850 Service Manual
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LG Prada KE850 Service Manual

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Service Manual
KE850
Date: March, 2007 / Issue 1.0

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  • Page 1 Service Manual KE850 Date: March, 2007 / Issue 1.0...
  • Page 2 REVISED HISTORY Editor Date Issue Contents of Changes S/W Version Y.W.YUN 10/23 * The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    Table Of Contents 1. INTRODUCTION .......7 5. Trouble shooting......75 1.1 Purpose ..........7 5.1 Trouble shooting test setup....75 1.2 Regulatory Information......7 5.2 Power on Trouble........75 1.3 ABBREVIATION ........9 5.3 Charging trouble ........79 5.4 LCD display trouble........81 2. PERFORMANCE ......11 5.5 Camera Trouble ........83 2.1 H/W Features.........11 5.6 Receiver &...
  • Page 5 - 6 -...

  • Page 6: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the KE850. 1.2. Regulatory Information A. Security example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE850 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 8: Abbreviation

    1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: APC Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milli-watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. INTRODUCTION LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Feature Item Feature Comment Standard Battery Li-ion, 800mAh AVG TCVR Current 270mA typ @PL5 Standby Current 2.3 mA typ @PP9 Talk time 3 hours (GSM TX Level 7) Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm) Charging time Under 3 hours RX Sensitivity...

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) ×...
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5ppm (13 MHz) tolerance 32.768KHz tolerance 30ppm...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.62V 3.62V~ 3.62V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh...
  • Page 16 2. PERFORMANCE * EDGE RF Specification (Option: is not serviced for “EDGE mode”) Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB GSM900/EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm 25dBm...
  • Page 17 2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 Output RF Spectrum GSM900/EGSM (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.

  • Page 18: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1. KE850 Component Block diagram. Figure 1 KE850 Hardware architecture KE850 is composed with 2 different PCB part such as main PCB, sub PCB The functional component arrangement is mentioned below diagram. Figure 2 KE850 Functional block diagram - 19 -...

  • Page 19: Baseband Processor (Bbp) Introduction

    3. TECHNICAL BRIEF 3.2. Baseband Processor (BBP) Introduction Figure 3 Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1. General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.
  • Page 20 3. TECHNICAL BRIEF 3.2.2. Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 21 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 22 3. TECHNICAL BRIEF 3.2.5. USART Interface KE850 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark USART0_TXD TXD_0 Transmit Data...
  • Page 23 3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE850 is using as follows except dedicated to SIM and Memory. KE850 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map Port function KE850 Description...
  • Page 24 3. TECHNICAL BRIEF GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio GPIO_22 Not Used CIF_D0 MM_AD0 ATI Chip Address CIF_D1 MM_AD1 " CIF_D2 MM_AD2 " CIF_D3 MM_AD3 " CIF_D4 MM_AD4 " CIF_D5 MM_AD5 " CIF_D6 MM_AD6 " CIF_D7 MM_AD7 "...
  • Page 25 3. TECHNICAL BRIEF GPIO_100 USB_EOC Input, Low in USB Charging, High in End of Charge DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For FM Radio, Audio AMP & Touch Panel I2C_SDA " PM_INT (EINT) PM_INT " CC_IO SIM_IO SIM CARD I/O...
  • Page 26 3. TECHNICAL BRIEF MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 SNDOUT_L For Speaker EPPA2 SNDOUT_R For Speaker MICN1 MICN For Mic MICP1 MICP " MICN2 HSMICN For Headset Mic MICP2 HSMICP "...
  • Page 27 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 28 3. TECHNICAL BRIEF EBU_RD_n EBU_BC0_n EBU_BC1_n EBU_A[0] EBU_A[1] EBU_A[2] EBU_A[3] EBU_A[4] EBU_A[5] EBU_A[6] EBU_A[7] EBU_A[8] EBU_A[9] EBU_A[10] EBU_A[11] EBU_A[12] EBU_A[13] EBU_A[14] EBU_A[15] EBU_A[16] EBU_A[17] EBU_A[18] EBU_A[19] EBU_A[20] EBU_A[21] EBU_A[22] EBU_A[23] EBU_A[24] EBU_CS0_n CS_Flash1n For INTEL 1st 512Mbit NOR Die EBU_CS1_n CS_RAM1n For INTEL 256 SDRAM EBU_CS2_n...
  • Page 29 3. TECHNICAL BRIEF EBU_WAIT_n EBU_SDCLKO EBU_SDCLKI EBU_BFCLKO EBU_BFCLKI EBU_CKE T_OUT0 TXON_PA For RF GPIO_44 VIBRATOR_EN Output, High Enable T_OUT2 For RF T_OUT3 " T_OUT4 " EINT3 " T_OUT6 MODE For RF GPIO_50 TP_ATTN For Touch Panel GPIO_51 LCD_ID Hitachi : L CC1CC3IO LCD BACKLIGHT LCD Backlight Control...

  • Page 30: Power Management Ic

    3. TECHNICAL BRIEF F32K to 32k crystal OSC32K to 32k crystal RESET_n RESETn CC1CC1IO TRIG_OUT For JTAG & ETM Interface RTC_OUT RTC_OUT VCXO_EN XO_ENE CLKOUT0 26M_DAC For Audio AMP GPIO_62 BT_RST For Bluetooth GPIO_63 SIM_EN_n 3.3. Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets.
  • Page 31 3. TECHNICAL BRIEF • Two single LED driver outputs for signaling • Vibrator driver with adjustable voltage • Fully controlable by software via I2C - Bus • Temperature and battery voltage sensors • Interrupt channels for peripherals • System debug mode •...
  • Page 32 3. TECHNICAL BRIEF SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 33 3. TECHNICAL BRIEF SM-POWER offers several control functions - Power-on Reset Generator with logic state machine - I2C bus interface - I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by Bluetooth) inputs - Programmable interrupt channels to handle peripherals like SIM, MMC and USB - Monitoring of charging functions - Under-voltage Shut-Down - Error flags (volatile or non-volatile) from many power-supply functions and thermal sensor in order...
  • Page 34 3. TECHNICAL BRIEF Figure 5 Power domain block diagram of KE850 VCHG VBAT VRF2V85 2V11_RTC R201 RTC_OUT 220K VCH_CTL C201 R203 2.2u VBACKUP PWRON VRF1V5 VBAT 1V5_Core 1V5_DSP KP_OUT1 2.2u 2.2u R204 C202 C203 Q201 2SC5585 2.2u 2.2u 2.2u C204 C205 KP_IN5 R205 100K...
  • Page 35 3. TECHNICAL BRIEF Charging & Battery Connector VCHG Q203 C229 C230 R219 VSUPPLY VBAT 100K VCH_CTL U205 R220 LOAD CN201 47mohm NDC652P IOUT LOAD D201 R222 ZXCT1010E5TA R223 BAT_ID C231 CRS08 2.2u 2.2K C232 C233 VCHS VBAT R225 0.15 C235 Figure 6 SM-Power circuit diagram with charging part 3.3.2.

  • Page 36: Power On/Off

    3. TECHNICAL BRIEF 8. Recharge voltage : 4.00V 9. Low battery alarm a. Idle : 3.50V~3.35V b. Dedicated : 3.59V~3.35V 10. Low battery alarm interval a. Idle : 3min b. Dedicated:1min 11. Switch-off voltage : 3.35V 12. Charging temperature adc range a.
  • Page 37 3. TECHNICAL BRIEF Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8). It might be triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF register.

  • Page 38: Sim Interface

    3. TECHNICAL BRIEF 3.5. SIM interface KE850 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 10). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power supply enabled by BBP (_SIM_EN). SIM Interface SIM_CLK : SIM card reference clock SIM_RST : SIM card Async /sync reset...

  • Page 39: Memory

    3. TECHNICAL BRIEF 3.6. Memory 1Gbit Flash & 128Mbit SDRAM employed on KE850 with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 256Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.

  • Page 40: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 240 x 400 265K Colors TFT LCD - Backlight : 4 piece of white LED illumination LCD module is connected to main board thru 35 pins connector. Table 7 LCD FPC Interface Spec. Pin No.

  • Page 41: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.
  • Page 42 3. TECHNICAL BRIEF MP3/Camera Sleep KP_OUT0 Figure 13 Touch FPCB part key matrix Volume up & down, Clear, Send, End/Power on keys are located on the Key FPCB. And MP3 hot key, Camera AF trigger & shutter and Lock keys are connected by Touch FPCB. - 43 -...

  • Page 43: Keypad Back-Light Illumination

    3. TECHNICAL BRIEF 3.9. Keypad back-light illumination There are 2 red color LEDs on the Key FPCB for keypad illumination. Keypad Back-light is controlled by GPIO port of the S-GOLD2. VBAT PRECHARGING & KEY BACKLIGHT LED 2V85_IO VBAT VCHG R102 120 R101 LD102 LD101...

  • Page 44: Lcd Back-Light Illumination

    3. TECHNICAL BRIEF 3.10. LCD back-light illumination Employed the AAT2806 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries. The backlight charge pump is capable of driving up to four LEDs at a total of 80mA. The current sinks may be operated individually or in parallel for driving higher current LEDs.
  • Page 45 3. TECHNICAL BRIEF Figure 16 EN/SET port control method Table 8 Charge pump IC LCD part current setting table - 46 -...

  • Page 46: Battery Current Consumption Monitor

    3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE850 use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. R219 VSUPPLY VBAT 100K U205 R220 LOAD CN201 47mohm IOUT...

  • Page 47: Audio

    3. TECHNICAL BRIEF 3.13. Audio KE850 Audio signal flow diagram as following diagram. Figure 19 Audio signal flow diagram - 48 -...
  • Page 48 3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8 load, 25mW per channel of continuous average power into stereo 32 single-ended (SE) loads and DAC.

  • Page 49: Multi Port Switch

    3. TECHNICAL BRIEF 3.13.2. Microphone circuit CN101 PWRON LED_R MIC101 SPM0204HE5-PB-3 C101 C102 VA101 VA102 CN202 PWRON LED_R MICP C220 0.1u FB201 C221 C222 0.1u FB202 MICN C223 VA201 VA202 VA203 VA204 VA205 VA206 R226 VMICP C225 Figure 22 Microphone circuit 3.14.
  • Page 50 3. TECHNICAL BRIEF MULTI-PORT SWITCH 1 JACK_DETECT USB_VBUS MULTI_PORT_0 REMOTE_INT USB_DP 2V72_IO VBAT MULTI_PORT_1 REMOTE_ADC USB_DM R203 R206 TXD_0 R208 VBAT RXD_0 U202 DG2799DN-T1-E4 R209 COM4 MULTI_PORT_1 IN1_2 JACK_DETECT IN3_4 COM2 REMOTE_INT REMOTE_ADC MULTI_PORT_0 R210 Q201 C204 USB_VBUS RN1307 0.1u R213 VUPU U203 STF203-22-TC...

  • Page 51: Usb Charging Circuit

    3. TECHNICAL BRIEF 3.15. USB charging circuit The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger circuit. The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of charging current is programmable I &...

  • Page 52: Fm Radio

    3. TECHNICAL BRIEF 3.16 FM radio The FM receiver uses a digital low-IF architecture which allows for the elimination of external components and factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (87.5 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers.

  • Page 53: Bluetooth

    3. TECHNICAL BRIEF 3.17. BLUETOOTH Figure 27 BLUETOOTH Functional block diagram. 3.17.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13•Ïm CMOS technology • Very low component count (6 external components) •...
  • Page 54 3. TECHNICAL BRIEF • Autonomous power down scenarios of Bluetooth and cellular system supported • Packages: - P-VQFN-48 package - P-WFLGA-56 package • Temperature range from -40°C up to 85°C • Boundary scan for interface lines via JTAG 3.17.2 Micro-Controller-Section •...
  • Page 55 3. TECHNICAL BRIEF 3.17.6 System Integration Figure 28 Mobile system integration The UART (serial interface) is used for the software interface between S-Gold2 baseband and the Bluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data (UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS).
  • Page 56 3. TECHNICAL BRIEF 2V72_IO C404 0.1u R404 I2S1_CLK R405 I2S1_WA0 R407 USIF_TXD I2S1_RX R409 USIF_RXD I2S1_TX C406 C407 C408 C409 SCL0_P0_13 VRF2V65 1V5_Core 1V8_SD PCMFR2_SDA0_P0_12 TP410 SLEEPX_P0_15 BT_VCXO_EN C420 0.1u CLK32K CLK32_P1_5 TRST_ RTCK WAKEUP_HOST_P1_8 JTAG_ WAKEUP_BT_P1_7 TP411 RESET_ BT_RST U402 VDDSUP RFOUT...

  • Page 57: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF 3.18. Micro SD external memory card slot The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold2 is connected to the module using a dedicated eight-pin connector Figure 30 Micro SD pin assignment Table 9 Micro SD memory pad assign. SD mode Pin No.
  • Page 58 3. TECHNICAL BRIEF Table 10 Micro SD memory card detect truth table. Micro SD card status it is removed it is inserted TF_DETECT High VMMC 2V72_IO TF_PWR_EN SI1305-E3 Q301 R327 100K R332 R333 R334 R335 R336 100K 100K 100K 100K 100K S301 49225-0821...

  • Page 59: 18Pin Multi Media Interface Connector

    3. TECHNICAL BRIEF 3.19. 18pin Multi Media Interface connector Table 11 Multi media interface pin assign KE850 MMI Pin Function Description FM_ANT FM radio antenna / Audio ground HS_MIC Headset microphone signal JACK_TYPE Accessory type detect HS_OUT_L / CTS Headset left sound / CTS HS_OUT_R / RTS Headset Right sound / RTS TXD / USB_DP /...
  • Page 60 3. TECHNICAL BRIEF 2V85_IO USB_VBUS 2V72_IO VCHG VSUPPLY R101 U101 LMV7291MGX-NOPB 2V65_ANA VIN- R102 HOOK_DETECT VIN+ C103 CN102 R103 R104 100p C104 L104 330K 100nH 1.5K C105 0.1u R111 2.2K L106 100nH HSMICN C106 0.1u HSMICP FB103 JACK_TYPE C108 C109 C110 FB104 22uF...

  • Page 61: Touchpad Interface

    3. TECHNICAL BRIEF 3.20. Touchpad Interface Ground 12C bus line (Data) 12C bus line (Clock) ATTEN 12C bus line (Attention) Power supply Voltage - 62 -...

  • Page 62: General Description

    3. TECHNICAL BRIEF RF circuit *RF Block Diagram Figure 34 KE850 RF part Block Diagram 3.21. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
  • Page 63 3. TECHNICAL BRIEF Figure 35 RF transceiver PMB7262 SMARTi-PM functional block diagram 2.2p 2.2p 1.2p 1.5p 1.5p 1.2p L404 L405 L406 L407 18nH 5.6nH VRF2V85 VRF2V7 5.6nH VRF2V85 VRF1V5 R412 C424 4700p C425 C426 C423 C427 VRF1V5 VRF2V85 0.1u 0.1u 0.1u VBIAS VDDTX1V5...

  • Page 64: Receiver Part

    3. TECHNICAL BRIEF 3.22. Receiver part Figure 37 Receiver part block diagram The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.

  • Page 65: Transmitter Part

    3. TECHNICAL BRIEF 3.23. Transmitter part The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates.

  • Page 66: Rf Synthesizer

    3. TECHNICAL BRIEF control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.

  • Page 67: Front End Module Control

    3. TECHNICAL BRIEF 3.26. Front End Module control Implemented in the S-Gold2 (U101) are three outputs which are VC2, VC3 and VC4 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.

  • Page 68: Power Amplifier Module

    3. TECHNICAL BRIEF 3.27. Power Amplifier Module The SKY77340 (U404) designed in a compact form factor for quad-band cellular handsets comprising GSM850/900,DCS1800,PCS1900, supporting GMSK and linear EDGE modulation. The module consists fo a GSM850/900 PA block and a DCS1800/PCS1900 PA block, impedance-matching circuitry for 50 ohms input and output impedances, and a Multi-function Power Amplifier Control(MFC) block.

  • Page 69: Mode Selection

    3. TECHNICAL BRIEF 3.28. Mode Selection Table 14 Mode Selection MODE VMODE RF INPUT VRAMP TX ENABLE Fixed Vramp control output Power High EDGE High Ramp Burst Control Vramp sets PA bias condition, fixed gain PA High MODE circuitry selects GMSK modulation (logic 0) or EDGE modulation (logic 1). VRAMP controls the output power for GMSK modulation and provides bias optimization for EDGE modulation depending on the state of MODE control.

  • Page 70: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Main PCB Top Main PCB Top placement - 71 -...
  • Page 71 4. PCB layout Main PCB bottom Main PCB bottom placement - 72 -...
  • Page 72 4. PCB layout Flash LED Bluetooth Chip Camera Connector RF PAM RF TRANSCEIVER Bluetooth Antenna 26MHz Main clock SIM Socket Charging Block Multi Media Chip Mobile Switch Sleep Crystal Memory Power Inductor PMIC Micro SD socket 100pin Connector Power Block Battery Connector - 73 -...
  • Page 73 4. PCB layout LCD backlight & Flash Vibrator LED Driver LCD Connector Connector 18pin I/O Connector Backup Battery FM Radio Multiport Switch Audio Block USB Charging Touch FPCB Connector Audio AMP KEY FPCB Connector 100PIN Connector Camera Volume Up LOCK KEY TOUCH FPCB Volume Down MP3/Camera...

  • Page 74: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
  • Page 75 5. Trouble shooting R201 RTC_OUT 220K PWRON KP_OUT1 R204 Q201 2SC5585 KP_IN5 R205 100K VBAT Remote Power On C224 0.1u U204 FSA2267AL10X RPWRON PWRON C_RPWRON R217 R218 100K 100K 2V72_IO 2V11_RTC R221 100K EXTRSTn SPOWER_INT PM_INT RESETn PMRSTn C234 0.1u - 76 -...
  • Page 76 5. Trouble shooting VCHG VBAT VRF2V85 2V11_RTC VCH_CTL C201 R203 2.2u VBACKUP VRF1V5 VBAT 1V5_Core 1V5_DSP 2.2u 2.2u C202 C203 2.2u 2.2u 2.2u C204 C205 C206 VRF2V7 VRF2V65 2V65_ANA 2.2u 2.2u VBAT 1V8_SD C207 C208 2.2u C209 VBAT FB201 VCHS VCHS VCXOEN XO_ENE...
  • Page 77 5. Trouble shooting START Connect power supply to the DUT Vbat = over 3.35V Check the "PWRON" signal RPWRON, = VBAT? replace U204 "_RESET" signal Check solder goes to high? U206 or replace it Check the all Check solder LDO's output U201 or replace it Is it correct? Check solder...

  • Page 78: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 79 5. Trouble shooting START 18pin IO(CN102) Resolder the Is soldered ? CN102 The TA can be broken Source pin Change other TA of Q203= then retest 4.8V ? Check solder Drain pin Q203 or replace it of Q203 = 4.7~4.8V ? D201 voltage Replace it drop...

  • Page 80: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( LCD FPCB, Connector on Sub PCB) -EMI filter soldering -Connector combination ICVE10184E150R101FR FL101 INOUT_B1 INOUT_A1 DIF_CS1 INOUT_B2 INOUT_A2 DIF_ADS 2V85_IO DIF_WR INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 DIF_RD R129 ICVE10184E150R101FR FL102 MLED1...
  • Page 81 5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Is LCD FPCB Replace LCD normal? module Check solder and Signal is normal on repair FL101, FL102, FL103, Damaged filter FL104, FL105 Assemble - 82 -...

  • Page 82: Camera Trouble

    5. Trouble shooting 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status 2M AF CAMERA CONNECTOR TO FPCB 2V8_CAM 2V8_CAM 2V8_AF 1V8_CAM FB301 FL301 ICVE10184E070R101FR C335 CIF_D7 INOUT_A1 INOUT_B1 0.1u INOUT_A2 INOUT_B2 CIF_D6 ICVE10184E070R101FR FL302 CN302 INOUT_A3 INOUT_B3 CIF_D5 CIF_PCLK...
  • Page 83 5. Trouble shooting START Check camera connector, 34pin main PCB connector combination then Camera test with equipped camera module FL301, FL302, FL303, Resolder FL304 are soldered well? Replace New Replace New Replace Camera module FPCB module Main Working properly? Working properly? Replace Camera module Replace FPCB module...

  • Page 84: Receiver & Speaker Trouble

    5. Trouble shooting 5.6 Receiver & Speaker trouble Check Points - Speaker pin contact - Audio amp soldering - analog switch soldering 2V85_IO U103 AUDIO AMP 2V72_IO 2V85_IO MIDI_L SNDOUT_L R140 HEADSET_L 3V3_AMP MIDI_R R141 C226 HEADSET_R SNDOUT_R 2V85_IO C121 R116 FSA2267AL10X 0.1u...
  • Page 85 5. Trouble shooting START Check Speaker tension and Contacts are clear. Resolder Analog DSR(R116), switch (U103, U105) FM_SEL_SND(R122) Low voltage? Check power LDO Ampís power on? (U204) (Check C249 Bias) Resolder or C249 is high voltage Replace Amp when amp on? (U205) Replace Sub PCB Assemble...

  • Page 86: Microphone Trouble

    5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from PWRON PWRON LED_R LED_R MIC101 MICP C220 0.1u FB201 C221 C222 0.1u FB202 MICN C223 SPM0204HE5-PB-3 C101 C102 VA101 VA102 R226 VMICP C225 - 87 -...
  • Page 87 5. Trouble shooting START Check microphone sound hole Check mic. Bias Mic bias ON line (R226) when call?(C225) Repair the 14pin 14pin connector conn. (CN202) is good? Replace Check Signal microphone FB201, FB202 (MIC101) Assemble - 88 -...

  • Page 88: Vibrator Trouble

    5. Trouble shooting 5.8 Vibrator trouble Check Points -Vibrator contact -IC is working correct VBAT VIBRATOR L101 C101 C102 56nH L102 27nH CLOSE TO CONNECTOR L103 U102 33nH SUY98005LT1G CLOSE TO R105 L105 CONNECTOR VIBRATOR_EN 100nH R110 VOUT R112 CN101 C107 100K Check the driver IC(U102)
  • Page 89 5. Trouble shooting Check line crack START Check Vibrator contact Check U102 or Pin1 of U102 is high replace it and Pin3 low? Replace connector Check Line & (CN101) Mold Crack Replace Vibrator Assemble - 90 -...

  • Page 90: Keypad Back Light Trouble

    5. Trouble shooting 5.9 Keypad back light trouble Check Points - Signal path is connected well - Analog SW is working properly VBAT PRECHARGING & KEY BACKLIGHT LED 2V85_IO VBAT VCHG R102 120 R101 R123 KEYBACKLIGHT U107 FSA4157L6X LD102 LD101 Q101 R124 1.5K...
  • Page 91 5. Trouble shooting START Check All of LEDs solder Check U107 or Power of U107 replace it OK? (R120) Replace 14pin 14pin connector conn. (CN202) is good? (CN202) Replace KEY FPCB Assemble - 92 -...

  • Page 92: Sim Card Trouble

    5. Trouble shooting 5.10 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM SIM_EN_n SI1305-E3 Q202 VA201 R224 J201 SIM_CLK SIM_RST SIM_IO C236 C237 C238 0.1u 150p Check soldering pin of socket - 93 -...
  • Page 93 5. Trouble shooting START Check All of SIM card voltage KE850 support 1.8V & 3V SIM only 6 pins are Resolder pin soldered well? Replace Q202 Check Q202 Assemble - 94 -...

  • Page 94: Microsd Trouble

    5. Trouble shooting 5.11 MicroSD trouble Check Points -Power control FET is working -Socket soldering -Card detect is working VMMC 2V72_IO TF_PWR_EN SI1305-E3 Q301 R327 100K R332 R333 R334 R335 R336 100K 100K 100K 100K 100K S301 49225-0821 SWA SWB GND TF_DETECT TF_DAT1 TF_DAT0...
  • Page 95 5. Trouble shooting START Check Micro SD card voltage (VMMC, 2V72_IO) Resolder it TF socket pins (check data line are well soldered TF dat 0,1,2,3) well? Replace Q301 is Q301(Check working? TF_PWR_EN) Assemble - 96 -...

  • Page 96: Touch Pad Trouble

    5. Trouble shooting 5.12 Touch pad trouble Check Points -FPCB pad Solder -FPCB Crack -Contorl IC working 2V85_IO CN102 TP_ATTN This fault depend on Touch-pad mainly. Almost of all case, Replace front touch panel. START Check Touch Sensitivity (If not replace front touch panel) Resolder CN102 FPCB PAD (CN102)Solder...

  • Page 97: Rf Part Trouble Shooting

    5. Trouble shooting 5.13 RF part Trouble Shooting 5.13.1 RF Components U401 SW401 U404 ANT PAD U403 X401 Main Top-View Main Bottom-View Figure 1. RF components REFERENCE NUMBER PART DESCRIPTION U401 Front End Module U403 RF Transceiver U404 Power Amp Module X401 VCTCXO(26MHz) SW401...
  • Page 98 5. Trouble shooting 5.13.2 Trouble Shooting of Receiver Part Checking Flow Checking Points START Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point VCTCXO Figure 2. Main PCB Check po PLL Control Check point Mobile SW & FEM Figure 3.
  • Page 99 5. Trouble shooting 5.13.3 Checking VCTCXO Circuit Checking Points Checking Flow Is the waveform Replace X401 of Pin3 similar to X401 Fig.6? Pin 4 : 2.7V Checking U201 Is the waveform (PMIC) of Pin4 similar to Fig.6? Pin 3: 26MHz VCTCXO Circuit is OK.
  • Page 100 5. Trouble shooting 5.13.4 Checking PLL Control signals Checking Points Checking Flow R416 (RF_EN) Check U404 EN Signal is OK? U404 Check U404 DA(Data) is Normal? Check U404 CLK(Clock) is Normal? R424 (RF_DATA) R422 (RF_CLK) Figure 7. Transceiver Control Signal is OK. See next page to check Mobile SW &...
  • Page 101 5. Trouble shooting 5.13.5 Checking Mobile SW & FEM Mobile SW & FEM Circuit Diagram VRF2V85 R403 C405 0.1u Front End Module U401 YGHF-S006A GMS_RX- GSM_RX+ VCTRL1 EGSM_RX- VCTRL2 EGSM_RX+ VCTRL3 DCS_RX- DCS_RX+ GND1 PCS_RX- GND2 PCS_RX+ GND3 GND4 TX1G GND5 TX2G GND6...
  • Page 102 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW40 with RF Cable Replace Mobile SW Signal is OK ? (SW401) Check Pin 20, 21, 22 of U401? Control Signal is Check PMB8876 (U101) Replace FEM (U401) Pin 16, 17 or 14, 15 Mobile SW &...
  • Page 103 5. Trouble shooting 5.13.6 Checking RX I/Q Signals Checking Flow Check RX I/Q Signals C458 C459 R431 R432 Replace Signals are Transceiver Normal ? R433 C462 C463 PMB6272(U404) R434 RX Part is OK. Figure 14. RX I/Q Circuit Check Base Band Circuit Re-Download S/W and Cal Checking Points U404...
  • Page 104 5. Trouble shooting 5.13.7 Trouble Shooting of Transmitter Part Checking Flow Checking Points Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point VCTCXO Check point PLL Control Figure 17. Main PCB Check point TX I/Q Signal Check point Transceiver Figure 18.
  • Page 105 5. Trouble shooting 5.13.8 Checking VCTCXO Circuit See RX Part “1. Checking VCTCXO Circuit” 5.13.9 Checking PLL Control Signal See RX Part “2. Checking PLL Control Signal” - 106 -...
  • Page 106 5. Trouble shooting 5.13.10 Checking TX I/Q Signals Checking Flow Check TX I/Q Signals C458 C459 R431 Replace Signals are Transceiver R432 Normal ? PMB6272(U404) R433 C462 C463 R434 TX Part is OK. Check Base Band Circuit Figure 19. TX I/Q Re-Download S/W and Cal Checking Points U404...
  • Page 107 5. Trouble shooting 5.13.11 Checking Transceiver Output Signals C424 4700p VRF2V85 VBIAS VDDTX1V5 U404 PMB6272 VDDTX2V8 VDDMIX2V8 RF Transceive R415 GND3 C434 C435 2.2u 2.2u GND4 R419 C443 R425 C448 C449 R427 C454 C455 Figure 22. Transceiver Output Circuit Checking Points U401 Figure 23.
  • Page 108 5. Trouble shooting Checking Flow Check Output Signal Replace Signals are PMB6272(U404) Normal ? Transceiver is OK. See next page to check PAM Control Circuit. LBAND_PAM_IN (MODE: GMSK) LBAND_PAM_IN (MODE: 8PSK) Figure 24. Transceiver Output (GMSK) Figure 25. Transceiver Output (8PSK) - 109 -...
  • Page 109 5. Trouble shooting 5.13.12 Checking PAM Control Signals PALEVEL R441 1.2K MODE R442 TXON_PA R443 820p C468 C469 C470 Figure 26. PAM Control Signals Checking Points U403 MODE TXON_PA PA_LEVEL Figure 27. Transceiver Output MODE MODE PA_LEVEL TXON_PA GMSK Ramp Burst Control HIGH 8PSK HIGH...
  • Page 110 5. Trouble shooting Checking Flow Check Control Signals Check Signals are PMB8876(U10) Normal ? PAM Control Signal is See next page to check FEM & Mobile SW Circuit Figure 28. GSMK Control Signal Figure 29. 8PSK Control Signal 1.MODE 2.PA LEVEL 1.MODE 2.PA LEVEL 3.TXON PA...
  • Page 111 5. Trouble shooting 5.13.13 Checking FEM & Mobile SW Mobile SW & FEM Circuit Diagram VRF2V85 C401 SW401 C403 KMS-506 R403 0.75p C405 0.1u Front End Module U401 YGHF-S006A GMS_RX- GSM850 GSM_RX+ VCTRL1 EGSM_RX- VCTRL2 EGSM EGSM_RX+ VCTRL3 DCS_RX- DCS_RX+ GND1 PCS_RX- GND2...
  • Page 112 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW40 with RF Cable Replace Mobile SW Signal is OK ? (SW401) Check Pin 20, 21, 22 of U401? Control Signal is Check PMB8876 (U101) Replace FEM (U401) Pin 16, 17 or 14, 15 Mobile SW &...

  • Page 113: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup Figure S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery •...

  • Page 114: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide 1. Copy "GSMULTI" Folder. Paste in " C:\" ➜ 2. Execute "GSMULTI.reg file" Registered at PC 3. "MultiGSM.exe" execution file ➜ 4. Munu "Setting" "Configuration" - 115 -...
  • Page 115 6. Download & S/W upgrade 6. Press the " START" button - 116 -...
  • Page 116 6. Download & S/W upgrade ➜ ➜ 7 Stand-by condition "Wait" is displayed connect the Phone KE850P40-7-V09a KE850 - 117 -...
  • Page 117 6. Download & S/W upgrade KE850P40-7-V09a KE850 KE850P40-7-V09a KE850 - 118 -...

  • Page 118: Circuit Diagram

    TP112 RPWRON RCV_N ON_SW ON_SW VBAT VBAT VSUPPLY RCV_P Engineer : URXD C134 C135 LG Electronics UTXD Drawn by : TP113 RTS_0 Size: TITLE: TP114 R&D CHK : CTS_0 V1_Main DOC CTRL CHK : 12 1 8 A Baseband Processor...
  • Page 119 C234 SIM_IO 0.1u C236 C237 C238 C235 0.1u 150p Engineer : LG Electronics Drawn by : Size: R&D CHK : TITLE: V1_Main DOC CTRL CHK : 12 1 8 A Memory, PMIC, SIM, Charging MFG ENGR CHK : Changed by:...
  • Page 120 TF_DAT2 BGND C341 C342 C343 C344 C345 C346 0.01u Engineer : LG Electronics Drawn by : Size: TITLE: R&D CHK : V1_Main DOC CTRL CHK : 12 1 8 A Multimedia, T-Flash, BtoB Connector MFG ENGR CHK : Changed by:...
  • Page 121 R441 1.2K MODE R442 TXON_PA R443 820p C468 C469 C470 Engineer : LG Electronics Drawn by : Size: TITLE: R&D CHK : V1_Main DOC CTRL CHK : 12 1 8 A RF, BLUETOOTH PAM(Skyworks) MFG ENGR CHK : Changed by:...
  • Page 122 INOUT_B4 INOUT_A4 DIF_D15 VA106 C137 C138 CN103 OJ102 Engineer: EVL5M02200 0.1u LG Electronics Drawn by: Size: TITLE: KE850 SUB R&D CHK: DOC CTRL CHK: 12 1 8 A LCD Conn, IO Conn, FM Radio... MFG ENGR CHK: Changed by: Date Changed: Time Changed: V 1.0...
  • Page 123 GPIO ADDR_ENB VDD_I_O R234 100K MODE C249 2.2u BYPASS C250 (1005) Engineer: LG Electronics Drawn by: Size: TITLE: R&D CHK: KE850 SUB DOC CTRL CHK: 12 1 8 A BtoB Conn, Multiport SW... MFG ENGR CHK: Changed by: Date Changed:...
  • Page 124 Sign & Name Sheet/ Sheets MODEL 1/12 Designer S.W.PARK 2006 1/12 Checked 2006 DRAWING CAMERA FPCB NAME 1/12 Approved Y.H.HEO 2006 DRAWING Iss. Notice No. Date Name LG Electronics Inc. Rev. 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 125 -...
  • Page 125 Section Date Sign & Name Sheet/ Sheets MODEL KE850 FPCB Designer SW.PARK Checked HJ.YANG DRAWING KEY, MIC, LED NAME Approved YM.CHO DRAWING Iss. Notice No. Date Name LG Electronics Inc. Rev. 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 126 -...
  • Page 126 KP_OUT0 Section Date Sign & Name Sheet/ Sheets MODEL V1 FPCB Designer SW.PARK Checked HJ.YANG DRAWING TOUCHPAD, KEY NAME Approved YM.CHO DRAWING Iss. Notice No. Date Name LG Electronics Inc. Rev. 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 127 -...

  • Page 127: Pcb Layout

    8. pcb layout - 128 -...
  • Page 128 8. pcb layout - 129 -...
  • Page 129 8. pcb layout LGMC - 130 -...
  • Page 130 8. pcb layout LGMC - 131 -...
  • Page 131 8. pcb layout - 132 -...
  • Page 132 8. pcb layout - 133 -...
  • Page 133 8. pcb layout - 134 -...
  • Page 134 8. pcb layout - 135 -...
  • Page 135 8. pcb layout - 136 -...
  • Page 136 8. pcb layout - 137 -...
  • Page 137 - 138 -...

  • Page 138: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4 00 V 0 000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_25.exe” - 139 -...
  • Page 139 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 140 -...
  • Page 140 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adjust the number of times. 9.2.6. Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal: control by GPIB Setup UART Port PWR : Power Supply CELL :Call-Test Equipment...
  • Page 141 9. RF Calibration 9.2.7. Select “MODEL”. 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 142 -...
  • Page 142 9. RF Calibration 9.2.10. Calibration data will be saved to the following folder. Saving format: year/month/day PASS - 143 -...
  • Page 143 9. RF Calibration Notices: 1. The state of Phone is “ test mode “ during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode”. 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 4.

  • Page 144: Stand Along

    10. Stand along 10. Stand along 10.1. Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. 4 Click “Update Info” for communicating Phone and Test -Program. Not Connected ➃ - 145 -...
  • Page 145 10. Stand along Connected 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. ➅ ➄...

  • Page 146: Tx Test

    10. Stand along 10.2. Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. ➀ 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “Write All”...

  • Page 147: Rx Test

    10. Stand along 10.3. Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Select “Rx” in the RF mode menu. 3 Finally, Click “Write All” bar and try the efficiency test of Phone. ➂ ➁ ➀ 4 The Phone must be changed “normal mode”...

  • Page 148: Engineering Mode

    11. ENGINEERING MODE 11. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END will switch back to non-engineering mode operation.
  • Page 149 - 150 -...

  • Page 150: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW 41 42 45 48 38 39 40 - 151 -...
  • Page 151 - 152 -...

  • Page 152: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Level Ref No Part Name Part Number Spec Color Remark GSM,BAR/FILP TGSM0045201 Black AAAY00 ADDITION...
  • Page 153 CAMERA SVCY0012001 CMOS ,MEGA ,2M AF (Toshiba, FPCB) GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) Pearl White MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color - 154 -...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Ref No Part Name Part Number Spec Color Remark SMZY00 MODULE,ETC SMZY0013701 256MB MicroSD,External Type WSAY00 SOFTWARE,APPLICATION WSAY0082401...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark SACE00 PCB ASSY,FLEXIBLE,SMT SACE0043401 Black PCB ASSY,FLEXIBLE,SMT SACC00 SACC0025901 Black BOTTOM CONNECTOR,BOARD TO CN102 ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT BOARD PCB ASSY,FLEXIBLE,SMT SACD00 SACD0035901 Black...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C128 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C129 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C130 CAP,CERAMIC,CHIP...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C226 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C227 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C228 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C229 CAP,CERAMIC,CHIP...
  • Page 158 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , FB104 FILTER,BEAD,CHIP SFBH0008103 ,SMD ,R/TP 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , FB105 FILTER,BEAD,CHIP SFBH0008103 ,SMD ,R/TP 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,;...
  • Page 159 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark R110 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP R111 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R112 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R114 RES,CHIP,MAKER ERHZ0000402...
  • Page 160 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark R217 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP R218 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP R219 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP R220 RES,CHIP,MAKER ERHZ0000505...
  • Page 161 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black MCCF00 CAP,MOBILE SWITCH MCCF0036901 MOLD, PC LUPOY HI-1002M, , , , , Silver MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) Pearl White SAFY00 PCB ASSY,MAIN SAFY0162201 KE850 EUABK EDGE Phone, MAIN PCB Black SAFF00 PCB ASSY,MAIN,SMT SAFF0084001...
  • Page 162 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C105 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C106 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C107 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C108 CAP,CERAMIC,CHIP...
  • Page 163 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C207 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP C208 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP C209 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP C210 CAP,CERAMIC,CHIP...
  • Page 164 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C338 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C339 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C340 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C341 CAP,CERAMIC,CHIP...
  • Page 165 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark R121 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP R122 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R203 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP R207 RES,CHIP,MAKER ERHZ0000401...
  • Page 166 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark DFN ,10 PIN,R/TP ,DUAL(2.8V/150mA , 1.5V/300mA) U305 EUSY0277501 LDO PBFREE VA201 VARISTOR SEVY0003801 18 V, ,SMD , VA301 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 X101 X-TAL...
  • Page 167 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C336 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C404 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C405 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C414 CAP,CERAMIC,CHIP...
  • Page 168 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark C465 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C467 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C468 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP CONNECTOR,BOARD TO CN302...
  • Page 169 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark R313 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R314 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R315 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R316 RES,CHIP,MAKER ERHZ0000405...
  • Page 170 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Remark R437 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R438 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R439 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T, R440 THERMISTOR...

  • Page 171: Accessory

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Ref No Part Name Part Number Spec Color Remark 3.7 V,800 mAh,1 CELL,PRISMATIC ,KE850 Prada BATT, Sealing bag change, Pb-Free ,;...
  • Page 172 Note...
  • Page 173 Note...

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