Huawei MU709 Series Hardware Manual page 62
Hspa+ lga module
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Also See for MU709 Series:
- Hardware manual (63 pages) ,
- Design manual (18 pages) ,
- Development kit manual (35 pages)
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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Item
Drop test
Life
High
temperature
operating life
High
temperature
& high
humidity
Temperature
cycle-Non
operating
ESD
HBM
(Human
Body Model)
ESD with
DVK (or
embedded in
the host)
Groups ≥ 2
Issue 09 (2017-12-15)
Test Condition
0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.
Operation mode: no
power, no package
Temperature: 85º C
Operation mode: working
with service connected
Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point
High temperature: 85º C
Humidity: 85%
Operation mode: powered
on and no working
Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point
High temperature: 85º C
Low temperature: –40º C
Temperature change
slope: 6º C/min
Operation mode: no
power
Test duration: 168 h,
336 h, 500 h, 1000 h for
inspection point
2 kV (Class 1 B)
Operation mode: no
power
Contact Voltage: ±2 kV,
±4 kV
Air Voltage: ±2 kV, ±4 kV,
±8 kV
Operation mode: working
with service connected
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard
Sample size
IEC60068-
3 pcs/group
2-32
JESD22-A1
50 pcs/group
08-B
JESD22-A1
50 pcs/group
10-B
JESD22-A1
50 pcs/group
04-C
JESD22-A1
3 pcs/group
14-D
IEC61000-
2 pcs
4-2
Results
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
62
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