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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
6.1 About This Chapter
This chapter describes the following aspects of the MU739 module:
6.2 Dimensions and Interfaces
Figure 6-1 shows the dimensions of MU739 in details.
Issue 01 (2011-08-24)
6
Dimensions and Interfaces
Customer PCB Pad Design
Label
Packing System
The final version will be with 0.6mm PCB, but the temperory samples are with 0.8mm PCB.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
Mechanical Specifications
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